COTS MEMS 2003 - The 3rd International Conference on Advances in Application of Integrated Commercial-Off-The-Shelf Micro-Electro-Mechanical Systems

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Overview

The 3rd conference in this series is designed to address the main issues facing MEMS and NEMS developers interested in commercialization of their technologies to the marketplace. In addition, MEMS developers, manufacturers and users will examine the the latest developments in:

Program features presentations by leading experts from industry, academia and government institutions addressing such topics as:

• Beyond the bubble: A fresh look at optical MEMS
• Is “COTS” for MEMS a bad way to spell COST?
• COTS MEMS - can non-silicon approaches be quicker?
• Moving RF MEMS from MOTS to COTS
• Picking your customers: Lessons from a MEMS manufacturing company
• MEMS standardization - cifMEMS
• From custom MOEMS to functional instruments
• MEMS, microsystems and top down nanotechnology roadmap
• MEMS research at Intel
• MEMS commercialization: Robust RF MEMS-enabled products, standard processes
• RF MEMS in Asia
• Comprehensive foundry services from a high-volume MEMS manufacturer
• Emerging opportunities for microsystems in scientific instrumentation
• Designing manufacturable MEMS - the convergence of design and manufacturing
• New products for low-cost packaging of MEMS
• Enabling routine analyses in drug discovery and development through microfluidics

Don’t miss this unique opportunity to learn about the most up-to-date COTS MEMS concept! REGISTER TODAY!

Featuring:

A special half-day Pre-Conference Workshop

Latest technology developments in the NEMS area showed the great potential of nanodevices, nanomotors and nanostructure-based MEMS to become commercially viable products in the nearest future. Is there a chance for NEMS to gain a significant sector of the market within the timeframe comparable with “conventional” MEMS and MOEMS? What this timeframe will be? This and other issues of this rapidly developing technology area will be addressed by this workshop’s faculty.

Bell Labs, Lucent Technologies
Peter Bosch GmbH
Raytheon Commercial Infrared

Agenda

Monday, October 20, 2003

8:00 Registration, Poster/Exhibit Setup, Coffee and Pastries

8:45 Chairperson’s Opening Remarks
Daniel J. Hyman, PhD, President, XCom Wireless, Inc.

9:00 Optical NEMS Devices and Applications
Dustin W. Carr, PhD, Principal Member of Technical Staff, Sandia National Labs
Sub-wavelength structures in high refractive index materials interact strongly with an incident optical field. We are studying areas where such effects can be utilized to realize potential devices. This talk will explore the design and fabrication of nanomechanical optical grating transducers for sensing applications, and some of the complex dynamic behavior that can be observed in optically coupled nanostructures.

9:40 Integrating Individual Carbon Nanotubes with MEMS Devices
Qi Laura Ye, PhD, Senior Research Scientist, Center for Nanotechnology, ELORET Corporation, NASA Ames Research Center
The development of technologies and processes that enable the reliable integration of functional nanoscale materials with MEMS structures will provide a new class of high performance nanodevices. Carbon nanotubes possess a unique blend of mechanical and electrical properties that make them attractive candidate materials for electromechanical devices. The recent development of plasma enhanced chemical vapor deposition growth approaches for carbon nanotubes has led to advances in sensors, nanoelectronics, field emitters and electromechanical devices. Our approach has been to combine wafer-scale nanopatterning to control the placement of catalyst seed particles with conventional MEMS processes and subsequently grow the well-aligned nanostructures to achieve functional MEMS structures. Examples of the different device processes and issues encountered with achieving reliability fabrication and testing will be presented.

10:20 Refreshment Break, Exhibit/Poster Viewing

10:50 Potential Applications for DNA-based Nanostructures and Nanodevices
Bernard Yurke, PhD, Distinguished Member of Technical Staff, Quantum Information and Optics Research Dept, Bell Laboratories, Lucent Technologies
The large combinatorial space of base sequences available and the specificity with which DNA strands interact makes possible a form of programmable self-assembly that has been used to construct a variety of complex nanostructures and nanodevices. Researchers are now looking beyond these demonstrations of principle and toward practical applications. Here we will describe some of the practical goals that are driving current research.

11:30 MEMS to NEMS Transition: Issues and Solutions
Speaker to be confirmed

12:10 Concluding Discussion. All workshop speakers available to take questions.

12:30 End of Workshop

Monday, October 20, 2003

1:00 Registration, Exhibit/Poster Viewing, Refreshments

1:55 Chairperson’s Opening Remarks
Chris Lumb, CEO, Micralyne Inc., Canada

2:00 Moving RF MEMS from MOTS to COTS
Daniel J. Hyman, PhD, President, XCom Wireless, Inc.
Dr Hyman discusses the RF MEMS industry rebirth from the ashes of telecommunications, and how this classic Military-On-The-Sideline technology can soon become not only Commercial but on virtual store Shelving. In the last few years, a number of prime defense contractors continue to boldly address the technical challenges of reliability and packaging, and consumer-oriented commercialization attempts by civilian RF MEMS developers have resulted in strong customer interest coupled with skepticism. XCom Wireless shares their alternative answer to the MOTS to COTS question, which first engages high-end microwave system developers.

2:30 MEMS Commercialization: Robust RF MEMS-Enabled Products, Standard Processes
Didier Lacroix, CEO, Discera, Inc.
MEMS providers must temporarily put aside unique complex devices and high levels of integration, focusing instead on simple, robust MEMS-enabled components that demonstrate to mainstream partners the benefits of the technology. This presentation will discuss an off-the-shelf component approach enabling fabless providers to partner with major manufacturers for volume production using standard materials, processes and packaging. In this way we can move the industry towards more complex MEMS products.

3:00 Enabling Routine Analyses in Drug Discovery and Development Through Microfluidics
Stephen D. O’Connor, PhD, CEO, Nanostream, Inc.
Microfluidic tools allow researchers to manipulate nanoliters of fluids involved in biological and chemical reactions. Nanostream has developed a modular approach to producing microfluidic systems designed to automate routine laboratory procedures critical to research productivity. This talk will introduce: (i) Snap-n-Flow™ technology, our modular product development platform; (ii) Nanostream's high-throughput chromatographic analysis system - a product developed using Snap-n-Flow™ technology; and (iii) other product development areas, including microfluidic systems for multi-step assays and micro-organic chemistry.

3:30 Refreshment Break, Exhibit/Poster Viewing

4:00 MEMS Research at Intel
Andrew Berlin, PhD, Director, Biotechnology Research, Intel Corporation
Intel has active research programs in several areas of MEMS. This talk will present an overview of our RF MEMS and Bio-MEMS research activities, with emphasis on an effort known as ‘Precision Biology’. Precision Biology combines MEMS-based microfluidics with nanostructured substrates and various optical techniques to dramatically enhance the sensitivity of molecular identification technology. A variety of protein and nucleic acid analysis results will be presented.

4:30 RF MEMS in Asia
Robert A. Haak, MBA, General Manager Japan Operations & Senior MEMS Analyst, ATIP, Japan
RF MEMS in R&D is increasing in Asia as companies, national labs, and universities are realizing that RF MEMS is the enabling technology for many system-on-chip (SoC) projects. Japan, Korea, Taiwan, Singapore, and China - to some extent - have RF MEMS research development programs. During the past 18 months, we have seen a tremendous downturn in the global telecommunications market, which to date has been the leading funding source for RF MEMS technologies. However, during this same time, we have seen increased spending in RF MEMS for SoC and stand-alone applications throughout Asia.

5:00 Panel Discussion - Turning MEMS and NEMS into Commercially Viable Products:
A remote goal or a technological reality?

Moderator:

Daniel J. Hyman

Panelists:

Mark G. Allen
Susanne Arney
Didier Lacroix
Stephen D. Senturia
Chris Lumb
Steven Walsh

5:45 End of Day One

Tuesday, October 21, 2003

8:00 Exhibit/Poster Viewing, Coffee and Pastries

8:40 Chairperson’s Remarks
Steven Walsh, PhD, Founding President of MANCEF, Albert Black Professor of Entrepreneurship, University of New Mexico

8:45 Keynote Address– Beyond the Bubble: A Fresh Look at Optical MEMS
Susanne Arney, PhD, Director, Microsystems Research, Bell Labs, Lucent Technologies
The Telecommunications “bubble” engendered extraordinary visibility for optical applications of MEMS (MOEMS or Optical MOEMS). Indeed, Optical MEMS technology played a key enabling role in the vision and crafting of an emerging Lightwave Network which is rapidly reconfigurable, robust and scalable. We will explore new possibilities for application of Optical MEMS concepts derived from this extremely rich period of MEMS development.

9:30 Is “COTS” for MEMS a Bad Way to Spell COST?
Stephen D. Senturia, PhD, Professor of Electrical Engineering, Emeritus, Massachusetts Institute of Technology; and
Chairman and Chief Technology Officer, Polychromix, Inc.
Many products are assemblies of more-or-less standard components with a few highly specific customized parts that capture the “secret sauce” of the technology. The question is not whether MEMS devices are among the customized parts. Rather, the question is whether MEMS devices developed as highly optimized components for one product will ever be able to be cost-effective “standard” components of other products without requiring complete redesign and unacceptable fabrication and packaging cost. The tentative answer, illustrated with selected examples, is a definite “maybe.”

10:00 Picking Your Customers: Lessons from a MEMS Manufacturing Company
Chris Lumb, CEO, Micralyne Inc., Canada
Micralyne’s experiences in successfully matching the needs of MEMS product development companies with capabilities of foundries will be discussed. Effective “selection” by a foundry of its customers can have a profound effect on the success of the product development exercise, and on the foundry’s business. Ensuring that an effective match is in place has allowed Micralyne to continue to grow both revenues and profits over the last five years, and Chris will share Micralyne’s insights into effective customer selection and project structuring.

10:30 Refreshment Break, Exhibit/Poster Viewing

11:00 COTS MEMS - Can Non-Silicon Approaches Be Quicker?
Mark G. Allen, PhD, Professor, School of ECE, Georgia Institute of Technology
Many commercially successful MEMS are based on the outgrowth of the silicon fabrication industry. Traditional silicon-based processes, however, often require either substantial capital equipment investment or adherence to foundry-prescribed design rules. Depending on the ultimate application, either approach can be prohibitive for a small, capital-limited company. Recently, there has been much non-silicon activity in MEMS fabrication, especially in the biological application arena, where non-silicon materials choices are often dictated by other considerations such as biocompatibility and mechanical flexibility. Such devices can often be produced by much lower capital cost equipment, such as relatively large-linewidth lithography in combination with casting, embossing, lamination, and/or electrodeposition. This talk will review some of these approaches and illustrate them through a case study: a passive resonator for physical property measurement.

11:30 Designing Manufacturable MEMS - The Convergence of Design and Manufacturing
Michael J. Jamiolkowski, PhD, President and CEO, Coventor, Inc.
The maturity of MEMS design software and manufacturing know-how are converging to support the successful, cost-effective commercialization of MEMS devices for targeted applications. A methodology for MEMS Design for Manufacturability (DFM) is presented that focuses on component reuse and rapid process and design qualification, from development of specifications to volume manufacturing. The result of such an approach is yields qualified designs that accurately predicted behavior for scalable, repeatable, cost-effective volume production.

12:00 Nanogetter™: A New Product for Low-Cost Packaging of MEMS That Require High-Vacuum and Hermetic Electrical Lead Transfer
Nader Najafi, PhD, President and CEO, Integrated Sensing Systems Incorporated (ISSYS)*
As part of its development effort to commercialize a Micro-Density Meter, ISSYS Inc. invented a new technology for long-term, low-cost, wafer-level, hermetic encapsulation of MEMS devices. Nanogetter™ offers to the MEMS community a “Total Solution” to the most important problem facing many emerging MEMS products. The technology offers: (1) wafer-level, high-vacuum (<1mTorr) encapsulation; (2) long-term vacuum stability; (3) hermetic electrical lead transfer; (4) compatibility with all MEMS technologies (polysilicon surface, bulk, silicon-on glass, and LIGA micromachining technologies); (5) high yield; (6) low cost. In addition to high-vacuum packaging applications, Nanogetter™ will be further developed to provide ambient environments suitable for applications requiring higher pressures. For example, for micro-switches and accelerometers, we will be able to absorb humidity and oxygen.
*In collaboration with: D. Sparks, NanoGetters, Inc.

12:30 Luncheon Sponsored by The Knowledge Foundation

1:55 Chairperson’s Remarks
Mark G. Allen, PhD, Professor, School of ECE, Georgia Institute of Technology

2:00 The International MEMS, Microsystems and Top Down Nanotechnology Roadmap
Steven Walsh, PhD, Founding President of MANCEF, Albert Black Professor of Entrepreneurship, University of New Mexico
This is a report developed by the International MEMS/Microsystems/Top Down Nanotechnology Roadmap committee. It is the culmination of four years effort from nearly four hundred individuals and firms from five continents. We will present some excerpts of it here designed to provide value to the reader. We provide: Ten early conclusions that can be drawn from this roadmap effort, some highlights in terms of technology trends, markets and products, the rationale and purpose behind the road mapping effort, the scope of the effort, the target audience of the report, and products that will be found in it by the reader. The roadmap seeks to assist stakeholders in the Microsystems commercialization community, specifically:
1) MEMS / MST based product users and potential users;
2) Suppliers to MEMS / MST manufacturers;
3) MST / MEMS manufacturers;
4) MST / MEMS researchers and research institutes;
5) Policy makers; 6) The Angel, Venture, M&A capital community;
7) Industrial and academic entities seeking to institute facilities.

2:30 MEMS Standardization - cifMEMS
Michael Gaitan, PhD, MEMS Project Leader, National Institute of Standards and Technology
An overview for the monolithic integration of microelectronics with MicroElectroMechanical Systems (MEMS) in standard CMOS technology is presented. The approach is based on designing glass passivation openings in the integrated circuit that expose the silicon substrate. The MEMS structures are micromachined by wet or dry silicon micromachining as a post-process to the standard CMOS process. This approach to MEMS fabrication can be implemented directly through any CMOS foundry; however, it is formally supported by the MOSIS service and NIST. Applications based on this method are presented including microheating elements, passing microwave elements, and test structures and standards to evaluate the mechanical properties of the thin films used in the IC process.

3:00 Surface Micromachined Amorphous Silicon Infrared Focal Plane Arrays for Dual-Use Imaging Applications
Thomas Schimert, PhD, Engineering Fellow, Raytheon Commercial Infrared, Raytheon
Surface micromachined amorphous silicon (á-Si) infrared focal plane arrays have found system insertion into several dual use imaging applications including firefighting as well as security and surveillance. Raytheon Commercial Infrared has several á-Si based infrared imaging products serving these applications. In this presentation, á-Si infrared focal plane array technology and its insertion into dual use imaging applications will be discussed.

3:30 Refreshment Break, Exhibit/Poster Viewing

4:00 Comprehensive Foundry Services from a High-Volume MEMS Manufacturer
Christoph Gahn, PhD, Project Engineer, Sensor Development, Robert Bosch GmbH, Germany
This talk will highlight the development from a purely internal MEMS supplier concentrated on automotive applications to a comprehensive MEMS provider offering complete product solutions as well as foundry services. In this context we will discuss our long standing experience with a Si surface micromachining foundry and our latest approach to the biomedical and microfluidic market using Si bulk micromachining process steps. By means of case studies we will provide an deeper insight into the relationship between foundry service provider and user.

4:30 Emerging Opportunities for Microsystems in Scientific Instrumentation
Yogesh B. Gianchandani, PhD, Associate Professor, EECS Dept, University of Michigan
With emerging research in nano/bio technology and the continuing shrinkage in critical dimensions of integrated circuits, there is a developing market for tools that facilitate the measurement of various kinds of physical and chemical properties with high spatial resolution. These instruments can facilitate diagnostics in both research and production environments and might, in some cases, be the bridge between these environments. This talk will focus on microcalorimetry and thermal microscopy within this context.

5:00 From Custom MOEMS to Functional Instruments
Hubert Jerominek, PhD, Director, Microoptics & Microsystems, INO, Canada
INO's experience in development and commercialization of two technological platforms for IR uncooled microbolometric cameras and other related instruments, as well as ultra-high definition scene projectors, will be presented. In both cases the critical components are MOEMS chips: microbolometer arrays and deformable microbridge mirror arrays, respectively. Building of viable business cases including targeted applications and markets will be discussed.

5:30 Open Discussion/Selected Oral Poster Presentations

5:45 Concluding Remarks/End of Conference

Call for Posters

Industry, academic and government scientists are encouraged to submit poster titles for this event. One-page abstracts (8 1/2" x 11" with 1-inch margins) must be submitted no later than September 19, 2003 for inclusion in conference documentation. Additional poster submissions will be accepted until October 10, 2002 but may not be included in conference documentation.

Dimensions of the poster board are:
4 feet wide by 3 feet high.
(It is possible also to rotate the board and use it vertically)

Note: If you're submitting a poster, you MUST be registered and paid registration fee plus posterboard reservation fee in advance to ensure that a posterboard is reserved for you.

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