0.1µm Gigascale Integration Challenges & Commercialization of Cryoelectronics Technologies in Microelectronics

Processing and Materials Challenges for 0.1µm Giga-Scale Integration
An Interdisciplinary Forum Designed to Ultimately Decrease the Cost of Achieving 0.1µm ULSI
San Francisco, CA -- Feb. 18, 1999

Conveniently timed with Commercialization of Cryoelectronics Technologies in Microelectronics

Chips with features as small as 0.18µm are already close to full production, and the SIA roadmap predicts commercialization of 0.1 µm devices by 2006. Compared to today's 0.18µm designs, 0.1µm design rules promise vastly superior performance. However, it is unclear how a chip designed to today's 0.18µm specifications will behave at 0.1µm design dimensions and many now recognize the materials and processing issues that face 0.1µm ULSI. With today's pressure to dramatically reduce product life cycles, combined with the market's insatiable demand for increased functionality and reduced costs, a consensus among scientists, research directors, and industry must be achieved. Critical scientific and engineering challenges must be defined to accelerate the potential of 0.1µm ULSI. With the combined participation of the distinguished faculty and conference delegates, this forum will facilitate development of intermediary benchmarks and decrease the cost of achieving 0.1µm ULSI. In order to achieve goals set up by the SIA Roadmap, and to stay competitive, a multidisciplinary forum is required to bring latest solutions and ideas to the forefront. This unique conference is an opportunity not to be missed. Space is limited, so register today to ensure your place.

Conveniently timed.
You are cordially invited to attend the featured presentation by Jim Richey of Motorola and pre-conference reception designed as an informal networking opportunity for participants of both events. Better yet, take advantage of our full adjacent program on cryoelectronics. Because of the synergistic potential of these two events, attend both and receive significant discounts on registration fees.

Schedule for PROCESSING AND MATERIALS CHALLENGES

Thursday, February 18, 1999

8:00 Registration for GSI, Arrivals, Coffee & Danish

8:55 Chairperson's Opening Remarks
Jeff Kelber

9:05 Industry/Government Partnership Needs for 100 nm and Beyond Microelectronic Technologies
Michael A. Schen

9:35 Deviations from Assumed Behavior, The Metrology of 0.1 Micron Polymer Films
Chris White

10:35 Refreshment Break

11:00 Low Dielectric Constant Materials with Controlled Porosity for Use in Future CMOS Device Manufacture
Kenneth R. Carter

11:30 Copper Surface and Interfacial Interaction Relevant to 0.1 Micron ULSI
Jeff Kelber

12:00 Key New Materials, Front-End Processes and Integration Issues
Pierre Fazan

12:30 Luncheon

1:00 Luncheon Presentations

2:00 Sub-0.1 µm Device Design and Optimization
Samar Saha

2:30 CMOS Scaling Below 0.1 µm: Issues and Challenges
Yuan Taur

3:00 Prospects for the Operation of SOI Devices in Sub-0.1µm Range
Francis Balestra

3:30 Refreshment Break

4:00 Metallization: Interconnects for Deep Sub-Micron Processes
Kenneth Rose

4:30 Panel Discussion: Fundamental Limits of Materials and Processing at 0.1µm Design Rules
Panel Leader: Gary Ray
Participants: Michael A. Schen, Bruce Gnade, Pierre Fazan, Dennis Herrell, Gary Ray, Jeff Kelber

5:30 Reception for both 0.1µm GSI and Cryoelectronics Delegates
Featured Presentation: The Future of High Speed Electronics: RF and Digital Electronics Will Converge to the Same Domain
Jim Richey

6:30 Close of GSI Conference


Commercialization of Cryoelectronics Technologies in Microelectronics
San Francisco, CA -- Feb. 19, 1999

Conveniently timed with 0.1µm Gigascale Integration Challenges

Overview:
The semiconductor industry continues to improve performance by scaling the computer chip. As these chips become smaller, dramatically increased density will require new concepts in thermal management. If this issue is not addressed, performance will not maintain its current pace with the shrinkage of the device. To address this hurdle, leaders in the microelectronics industry have begun experiments utilizing cryo-cooling approaches, and many believe that cryo-cooling will be the solution for thermal management of high throughput computing systems.

However, many questions remain.
This unique program will address the most recent technological advances made toward practical commercial application in microelectronics.

Key areas that will be addressed include:

  • Packaging
  • Refrigeration
  • Cost-Effectiveness

In today's competitive marketplace, you cannot afford to ignore the advantages that cold electronics can provide through increased performance. Space is limited so register today to ensure your place.

Conveniently timed.
You are cordially invited to attend the featured presentation by Jim Richey of Motorola and pre-conference reception designed as an informal networking opportunity for participants of both events. Better yet, take advantage of our adjacent program on 0.1µm ULSI. Because of the synergistic potential of these two events, attend both and receive significant discounts on registration fees.

How you will benefit from this conference
With longer presentation times, Q&A sessions and panel discussions both speakers and delegates can probe deeply into some of the controversy surrounding cryoelectronics -- and fully explore both it's commercial potential and role in achieving SIA goals. In addition, with informal opportunities for networking and problem solving there will be ample time to explore possible collaborative opportunities as well as discuss information provided throughout the conference.

Schedule for CRYOELECTRONICS TECHNOLOGIES in MICROELECTRONICS

Friday, February 19,1999

8:00 Registration for A.M. Arrivals, Coffee & Danish

8:55 Chairperson's Opening Remarks
Dennis Herrell, Fellow, Advanced Micro Devices, Inc.(AMD)

9:00 Cryoelectronics: A Cool Approach to NTRS '97 Goals
Kenneth Rose

9:30 Design and Technology Solutions for Sub-Ambient Operation of CMOS Systems
Uttam Ghoshal

10:00 Thermal Storage and Phase Change Materials in the Thermal Management of Cold- and Cryo-Electronics
Maurice Marongiu, PE

10:30 Refreshment Break

11:00 Mixed-Refrigerant Coolers for Electronics Applications
Eric K. Moser

11:30 Active Thermal Management for the Operation of Integrated Circuits Below Ambient
Hylan B. Lyon, Jr.

12:00 Luncheon

12:30 Luncheon Presentations*

1:30 Device and Performance of Cooled CMOS
Yuan Taur

2:00 Ultrafast Superconductor Digital Electronics
Konstantin Likharev

2:30 Status and Trends in the Cryogenic Operation of Deep Sub-Micron Bulk and SOI MOSFETs
Francis Balestra

3:00 Refreshment Break

3:30 The Potential Impact of Cryogenic Cooling on the Performance of Electronic Systems
Martin Nisenoff

4:00 The Elusive $500 Beer-Can Sized Cryo-cooler
Chad Joshi

4:30 The Application of Vapor Compression Refrigeration to ULSI Thermal Management
John Peeples

5:00 Panel Discussion: Critical Look at the Commercial Viability of Cold Electronics
PANELISTS: Dennis Herrell, Vivek Mansingh, Hylan B. Lyon, Jr., Chad Joshi

6:15 Closing Remarks
James Richey

6:30 Close of Conference


Participating Organizations

Advanced Micro Devices, (AMD)

Applied Thermal Technologies

Electronic Technology Office Defense Advanced Energen

KryoTech Corporation

Hewlett Packard

Hypres

IBM Research Laboratory

IBM T.J. Watson Research Center

Institut National Polytechnic Grenoble(ENSERG)

Intermagnetics General Corp.

Marlow Industries

MJM Engineering CO./PCM Thermal Solutions

Motorola, Inc.

National Institute of Standards and Technology Naval Research Laboratory

NIST Advanced Technology Program

Rensselaer Polytechnic Institute

Research Projects Agency (DARPA)

State University of New York at Stony Brook
http://gamayun.physics.sunysb.edu/RSFQ/
and
http://rsfq1.physics.sunysb.edu/~likharev/

Swiss Federal Institute of Technology (EPFL)

VLSI Technology, Inc.

University of North Texas

Increase Your Presence at Both Events!

Sponsorships, Exhibits, Hospitality Suites and Advertisements Delegates are looking to make informed choices, particularly at this critical juncture in the emergence of these and related technologies. Take advantage of tailored opportunities to reach a very targeted, decision-making audience. We offer packages to suit almost any budget, each designed to maximize your organization's exposure and facilitate networking at this event. Companies which offer products and services related to cryogenics, cooling, electronic materials or fabrication technologies will find this particularly beneficial.

Call Craig Wohlers at 617-232-7400 ext. 205 to discuss your needs and how you can take advantage of this historical event to maximize your company's exposure! Note: Due to space constraints, Sponsorship and Exhibit Opportunities are very limited, so please call early to avoid disappointment.


Call for Delegated Submitted Presentations

Registered delegates are encouraged to submit titles and abstracts for review as a 10-minute oral presentation. Abstracts must be no longer than one-page (8 1/2 x 11 with 1-inch margins) and must be submitted no later than January 15, 1999 for review by the GSI & Cryoelectronics conference faculty. Those selected for oral presentations will be notified no later than February 1, 1999 to allow time for preparation. All abstracts submitted may be included in the conference documentation if received prior to February 1. (Note: You must be a registered delegate to be considered for an oral presentation. Please use online registration form.)

Topical areas for Giga-Scale Integration conference:
Proposed presentations should focus on solution-oriented approaches for materials and process limitations at < 0.1 micron. Key areas include, but are not limited to Diffusion Barriers, Gate Oxides & Dielectrics, Low Dielectric Materials and Metallization. Approaches may be either materials or design related.

Topical areas for Cryoelectronics Application in Microelectronics conference:
Proposed presentations should be solution-oriented and focus on key technological challenges and means to overcome them to facilitate commercial application of cryo-cooling in microelectronics. A key area to be addressed will be integration of refrigeration, cooling devices into high-performance electronics. Circuit design perspective is emphasized, however, technical presentations from cryogenic researchers and developers are also encouraged.


Comprehensive Documentation Available

You can purchase a full set of conference documentation. Simply check the box on the conference documentation order form and mail us your payment of US$395. Please allow 4 weeks after the conference date for delivery.

Registration Information

 Registration fee for each conference includes lunch for each conference, reception, refreshments and all documentation made available to us by speakers. Commercial registration for each is US$895. An academic rate of US$595 is extended to all participants registering as full time employees of government and universities. To recieve the academic/government rate you must not be affiliated with any private organizations either as consultants or owners or part owners of businesses. On-site registration is an additional $100.

Discounted rate for both conferences: $1395 commercial and $895 academic.

Payment: All payments must be made in U.S. funds drawn on a U.S. bank. Please make check(s) payable to The Knowledge Foundation, Inc. and attach to the registration form even if you have registered by phone, fax or e-mail. Payment is required prior to the conference to confirm your registration. Confirmation of your booking will follow.

Discount Accommodations and Travel: A block of rooms has been allocated at a special reduced rate. Please make your reservations directly by January 21, 1999. When making reservations, please refer to the The Knowledge Foundation. Contact The Knowledge Foundation if you require assistance.

Venue:
The Clift Hotel
495 Geary Street
San Francisco, CA 94102
Tel: 1-800-65-CLIFT
Fax: (415) 931-7417

The Knowledge Foundation's official travel agent, Aries Travel can assist you in making all your air travel arrangements. For more information contact Aries Travel at 617-720-1420.

Substitutions/Cancellations: A substitute member of your company may replace your attendance at any time at no charge if you find your schedule prevents you from attending. Please notify us immediately so that materials can be prepared. If you do not wish to substitute your registration, we regret that your cancellation will be subject to a $100 processing fee. To receive a prompt refund, we must receive your cancellation in writing 15 days prior to the conference. Unfortunately cancellations cannot be accepted after that date. In the event that The Knowledge Foundation, Inc. cancels an event, The Knowledge Foundation, Inc. cannot resume responsibility for any travel-related costs.

Register me for one or both of these exciting conferences!

Fax/mail me a complete conference brochure with session abstracts.

To register online for one or both of these exciting events, use our convenient online registration form. You can also request more information by emailing us at: rfamigli@knowledgefoundation.com

Related Resources:

Cryogenics, Elsevier Science's leading international journal of low temperature engineering, including applied superconductivity, cryoelectronics and cryophysics, will be available at the Commercialization of Cryoelectronics Technologies in Microelectronics conference. For further information, please visit the Journal homepage at: http://www.elsevier.nl./locate/cryogenics

Supporting Organization:

CSA logo

The Cryogenic Society of America, Inc., is a non-profit society serving all those interested in any phase of Cryogenics. The Society will be celebrating its 35th year in 1999. Membership includes engineers, physicists, other scientists, sales representatives, technicians, all levels of management, systems designers and operators and a host of other occupations, with a wide range of academic degrees and from more than 15 countries.

The Society exists to encourage the dissemination of information concerning low temperature processes and techniques; to bring together those in all disciplines concerned with the applications of low temperature technology; to promote research and development of low temperature processes by meetings, professional contacts, papers, reports and publications; and to increase public awareness of the usefulness of cryogenic technology.

There are presently 100 corporate sustaining member companies, described on the CSA website.

Timely programs of current interest are held by the active chapters: Midwest, New England, Hampton Roads, Northern California, with others in formation in various parts of the country. There is also some interest in founding a European chapter.

CSA publishes its quarterly newsletter, COLD FACTS, which accepts articles and advertising.

For more information, visit the website, http://www-csa.fnal.gov, or contact Ms. Laurie Huget, Executive Director, Cryogenic Society of American, Inc., 1033 South Blvd., Suite 13, Oak Park IL 60302, 708/383-6220, fax 708/383-9337, csa@huget.com.

Another Exciting Workshop:

Cryogenic Engineering Conference & International Cryogenic Materials Conference "Helium Cryogenics: Liquid and Gas," on Monday, July 12, in Montreal, Quebec, Canada, at the Montreal Convention Centre, in conjunction with the 1999 CEC/ICMC.




The Knowledge Foundation, Inc.
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Knowledge Foundation publishing division. Showcases cutting edge materials science and bioscience resources.
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Phone: (617) 232-7400   Fax: (617) 232-9171
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