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Thursday,
August 3, 2000
8:00 Registration, Exhibit
and Poster Set-up, Coffee and Danish
Commercial-Off-The-Shelf
MicroElectroMechanical Systems & Devices
9:00 Chairperson’s Welcome
and Opening Remarks
Rajeshuni Ramesham, Ph.D., Applications Engineering Group, Quality
Assurance, Engineering Mission Assurance Directorate, Jet Propulsion
Laboratory; California Institute of Technology
9:15 DARPA MEMS Program
William C. Tang, Ph.D., MEMS Program Manager, Microsystems Technology
Office (MTO), Defense Advanced Research Projects Agency (DARPA)
Using an ever-expanding set of fabrication processes and materials,
MEMS will provide the advantages of small size, low power, low mass,
low-cost and high-functionality by integrating electromechanical systems
both on the micro as well as on the macro scales. Further, demands for
increased performance, reliability, robustness, lifetime, maintainability
and capability of military equipment of all kinds can be met by the
integration of MEMS into macro devices and systems. MEMS will be successful
in all applications where size, weight and power must decrease simultaneously
with functionality increases, and all while done under extreme cost
pressure. The long-term goal of the DARPA MEMS program is to merge information
processing with sensing and actuation to realize new systems and strategies
to bring co-located perception and control to systems, processes and
the environment. Short-term goals include: demonstration of key devices,
processes and prototype systems using MEMS technologies; development
and insertion of MEMS products into commercial and defense systems;
and lowering the barriers to access and commercialization by catalyzing
an infrastructure that can support shared, multi-user design, fabrication
and testing.
9:45 Single Crystal Silicon
Technologies for COTS MEMS
Nadim Maluf, Ph.D., Manager of Advanced Technologies, Lucas NovaSensor,
Inc.; TRW Automotive Electronics
MEMS structures and systems are slowly gaining wide acceptance in applications
spanning from automotive sensors to microfluidics for biochemical analysis.
Pressure and acceleration sensors are two examples of COTS MEMS with
annual production volumes in the tens of millions. But unlike the semiconductor
industry, the MEMS industry lacks an equivalent to the ubiquitous CMOS
process. Instead fabrication and manufacturing processes are customized
to fit the end application. One family of processes relies on the bulk
micromachining of single crystal silicon because of its robustness,
repeatable electrical and mechanical properties, and the efficient use
of the depth dimension. We are developing a family of COTS single crystal
silicon MEMS structures and subsystems that expand beyond the traditional
pressure and acceleration sensors to include microfluidic devices and
valves, as well as optical devices. We will review here the latest in
these development efforts, as well as explain the key issues relevant
to the efficient manufacture of COTS MEMS.
10:15 Microfluidic Systems
as COTS MEMS: Applications in Biotechnology
Antonio J. Ricco, Ph.D., Director, Microfabrication Technology, ACLARA
BioSciences, Inc.
Modern genetic analysis and drug discovery depend increasingly on the
analysis of large numbers of samples in parallel with rapidity, accuracy,
and low relative cost. New analytical systems should provide order-of-magnitude
increases in analysis throughput and comparable decreases in cost per
sample, capitalizing on advances in genomics, combinatorial chemistry,
and assay technologies. To address these needs, we are developing cost-effective
single-use plastic LabCard™ systems that use electrokinetic effects
to transport liquids through interconnected microchannels. In key applications
such as high-throughput drug screening and clinical diagnostics, disposability
obviates carryover and contamination problems. The latest developments
in the application of this technology to DNA sequencing and fragment
analysis, pharmaceutical candidate screening, and sample preparation
will be described. A new technology to realize homogeneous assays using
nL volumes of precious reagents with novel evaporation control methods
over extended incubation periods will be presented.
10:45 Exhibit/Poster Viewing
and Refreshment Break
11:00 Enabling the Acceleration
of New BioMEMS Applications with a User-Configurable Microfluidic Tool
Kit
Chris Lumb, CEO, Alberta Microelectronic Corp.
As the use of MEMS in bioassay applications rises, one of the limiting
factors to the development of new applications is the lack of a suitable
platform that can be used by development groups that are rich in applications
expertise but relatively new to the area of microfluidics. A technology
platform that incorporates electronics and optics in a modular format
has been developed and can be utilized by groups engaged in microfluidics
assay and instrumentation development in genomics, proteomics, diagnostics,
and analytical chemistry.
11:30 MEMS for Performance-Oriented
Sensor Applications
Robert M. Whittier, Director, Silicon Microsensors, Endevco, a Meggitt
PLC Company
The development of specialized, performance-oriented, COTS MEMS sensors
has required a variety of innovative design and process approaches.
Examples of acceleration and pressure microsensors will be presented
pointing out the design and process approaches which have been key to
providing the required performance. Trade-offs must always be made,
for example, that to provide the proper balance of performance and cost,
and the commercialization of this advanced technology has required considerable
breadth of understanding, capabilities and innovation. These will be
discussed to provide an understanding of what is necessary to manufacture
these types of devices.
12:00 Speaker Roundtable
Luncheon
Delegates are invited to join participating speakers during lunch to
informally discuss their presentations and “hot topic” issues related
to COTS MEMS.
1:10 Chairperson’s Remarks
Antonio J. Ricco, Ph.D., Director, Microfabrication Technology, ACLARA
BioSciences, Inc.
1:15 Thin-Film Shape-Memory
Alloy Technology in MEMS Applications
A. David Johnson Ph.D., President, TiNi Alloy Company
In thin-film, titanium-nickel (TiNi) shape memory alloys present new
opportunities for the development of MEMS devices. Because of their
high work output per unit volume, the materials are especially suitable
for fast, forceful microactuators in miniature valves and flow controllers,
microrelays and microswitches. TiNi thin film actuators are also TLL
voltage compatible, biocompatible and micromachinable. They scale well
too.
1:45 Principles and Applications
of the Digital Micromirror Device in Projection Displays
Richard Gale, Ph.D., Distinguished Member, Technical Staff, Applications
Research & Development, Digital Imaging Technology Development, Texas
Instruments
The Digital Micromirror Device will be described in detail, including
fabrication, operation, and key considerations in system integration.
A brief description of the product development path will be given and
several novel applications discussed.
Commercial-Off-The-Shelf MEMS Software Packages
2:15 MEMS: Rapid Time
to Market
Fariborz Maseeh, Ph.D., President and Chief Executive Officer, IntelliSense
Corporation
Rapid growth and commercialization of MEMS requires equally rapid product
development. While tremendous market opportunities exist for a variety
of MEMS devices, rapid development has become a leading commercialization
challenge. Successful MEMS commercialization addresses many of the challenges
currently producing lengthy development cycles through, 1) collaboration
between MEMS experts and industry experts, 2) utilization of MEMS design
infrastructure, and 3) established MEMS foundries. Our software design
tool (IntelliSuite), product development expertise and manufacturing
infrastructure has enabled rapid commercialization of MEMS for companies
around the world.
2:45 Exhibit/Poster Viewing
and Refreshment Break
3:30 Design Methodologies
for MEMS Device and Package Design
Stephen F. Bart, Ph.D. Director of Engineering, Applications and
Services, Microcosm Technologies, Inc.
In order to transition MEMS development from a process that is essentially
research to a process that supports schedules and costs that are consistent
with commercial-off-the-shelf product development, a unified, concurrent
design approach, supported by CAD tools, is needed. In this talk we
examine several case studies which illustrate the use of concurrent
design methodology between the system designer, the MEMS designer, the
package designer, and the circuit designer(s). We also examine the CAD
tool functionality that is required for effective communication between
these groups.
4:00 MEMSCAP Design Methodology
to Reduce MEMS Design Cycle-Time
Arnaud Delpoux, QA Manager, MEMSCAP S.A.
The development cycle-time of MicroElectroMechanical Systems is much
longer than the one of IC’s. This comes from the gap existing between
the different disciplines and actors of a MEMS design. By integrating
the solving of those different disciplines within a unique environment,
the MEMScAP solution bridges the gap and therefore enables, as early
as possible, the design, simulation and optimization of the entire system.
4:30 Selected Oral Poster
Presentations
5:00 Close of Day One
5:15 Opening Night Networking
Reception in Exhibit Area *cash bar
Friday, August
4, 2000
8:00 Exhibit/Poster Viewing,
Coffee and Danish
Microelectromechanical
Integration Strategies
8:45 Chairperson’s Remarks
Roger T. Howe, Ph.D., Professor of Electrical Engineering and Computer
Sciences and Department of Mechanical Engineering; Director, Berkeley
Sensor & Actuator Center, University of California at Berkeley
9:00 New Directions in
Integrated Microsystems Technology
Roger T. Howe, Ph.D.
This presentation will critically examine the various strategies for
integrating microstructures and electronics. Recent progress in applying
LPCVD poly-silicon-germanium (poly-SiGe) as a MEMS structural and sacrificial
material makes a “MEMS-last” post-CMOS paradigm feasible. There has
also been significant progress in integration by massively parallel
assembly. The talk will conclude with an assessment of co-fabrication
and assembly as technologies for microsystem fabrication.
9:30 COTS MEMS in Atmospheric
Observing Systems
David J. Carlson, Ph.D., Director, Atmospheric Technology Division,
National Center for Atmospheric Research
We supply sensor systems for observations of weather, climate, and air
quality around the world. These systems, operated on the ground or from
balloons or aircraft, incorporate advanced microelectromechanical systems
as sensors or sensor components and as integral components of control,
signal processing, and communication functions. Coupling in-house components
with modern COTS MEMS allows us to achieve design flexibility, high
reliability, and reduced power consumption, important factors in modern
sensing systems.
10:00 Microfluidic Systems
for Diagnostics and Drug Discovery Markets
Farzad Pourahmadi, Ph.D., Director, Microfluidics Technology, Cepheid
The revolution currently underway in clinical diagnostics, life science
research and drug discovery fields is attributed, in part, to the productivity
and the efficiency microfluidic-based platforms and processes bring
to the existing established but labor-intensive and time-consuming processes.
The adaptability of these systems, in conjunction with their flexibility,
cost-effectiveness and speed allows for integration of whole or subsets
of a larger platform into systems for distinct applications towards
specific markets. From these diverse applications have evolved a wide
spectrum of microfluidic and MEMS-based platforms with applicability
from diagnostics and pathogen detection to drug discovery fields. The
objective of this presentation is to discuss and emphasize the significance
and impact of microfluidics and MEMS platforms currently have on revolutionizing
clinical diagnostics, drug discovery and pharmacogenomics fields.
10:30 Exhibit/Poster Viewing
and Refreshment Break
Reliability and Quality Assurance of COTS MEMS
11:15 Reliability Issues
of COTS MEMS for Space Applications
Rajeshuni Ramesham, Ph.D., Applications Engineering Group, Quality
Assurance, Engineering Mission Assurance Directorate, Jet Propulsion
Laboratory; California Institute of Technology
During the last decade and a half, research and development of microelectromechanical
systems has shown significant promise for a variety of commercial applications
including automobile and medical purposes. For example, accelerometers
are widely used for air-bag deployment in automobile and pressure sensors
for various industrial applications. Some MEMS devices have the potential
to become commercial-off-the-shelf (COTS) components. While high reliability
applications including aerospace require much more sophisticated technology
development, they would achieve significant cost savings if they could
utilize COTS components in their systems. This paper reviews the current
status of MEMS packaging technology from COTS to specific application,
provides lessons learned, and finally, identifies a need for a systematic
approach for this purpose.
11:45 Design for Reliability
of MEMS for Lightwave Telecommunications
Susanne Arney, Ph.D., Technical Manager, MEMS Reliability Research,
Bell Labs, Lucent Technologies
Optical Micro-Electro-Mechanical Systems (MOEMS) comprise a disruptive
technology whose application to telecommunications networks is helping
to transform the horizon for lightwave systems. I will provide an overview
of MOEMS devices and reliability studies in a context in which design
flexibility, functionality and commercialization of MOEMS are impacted
by materials systems, processing complexity, and reliability.
12:15 Lunch on your own
1:40 Chairperson’s Remarks
Reza Ghaffarian, Ph.D., Senior Member Engineering Staff, Jet propulsion
Laboratory; California Institute of Technology
1:45 Test Development
Principles for MEMS Devices
Theresa Maudie, Test Development Manager, Sensor Products Division,
Motorola
Design validation and production level test development will be presented
with an emphasis on packaging, nest, and fixturing influences. The discussion
will focus on a typical MEMS accelerometer and pressure sensor test
process, coverage, validation, cost, and throughput considerations.
The need to synchronize a physical stimuli during MEMS testing creates
unique challenges compared to the semiconductor industry. Variety of
MEMS package styles also creates a challenge for testing based on the
lack of industry standards. A general test system model will be presented
and several test schemes used for high volume production testing of
accelerometer and pressure sensor devices will be discussed.
2:15 Packaging for MEMS,
MEMS for Packaging
James C. Lyke, MSEE, Microsystems Program Manager, Space Vehicles
Directorate, Air Force Research Laboratory
Packaging approaches to MEMS devices must address the same issues that
packaging approaches for standard microelectronics do, except that the
range of considerations must be expanded to include environmental interactions.
Most successful packaging approaches leverage existing approaches, alleviating
the need to invent a new infrastructure. MEMS itself offers new approaches
and techniques to improve the art of packaging, ranging from thermal
management to micro-connectors.
2:45 Hermetic Packaging
of COTS MEMS
Richard Ramos, Principal, Richard Ramos & Associates
The one thing deterring the viability of COTS MEMS is the ability to
hermetically seal the device in a package with an environment inside
the package that is conducive to the operation and life of the device
without damaging the device and do it in a high yield, volume production
process that is economically viable. This presentation will describe
in detail a proven process and the equipment to do just that.
3:15 Exhibit/Poster Viewing
and Refreshment Break
Market Opportunities and Applications
3:45 Silicon Carbide-Based
Microsystems for Harsh Environments
Walter Merrill, Ph.D., Executive Director, Glennan Microsystems Initiative
The application of microsystems to harsh environments, characterized
by high temperatures and/or corrosive or chemically active agents, is
particularly challenging. Silicon carbide-based microsystems offer many
advantages over silicon devices in these environments. An example project,
a silicon carbide pressure sensor with integrated electronics, is described
along with the development of a multi-user, silicon carbide process
for commercial applications.
4:15 A Consortium Approach
to Accelerating MEMS Commercialization
Robert F. Miracky, Ph.D., Vice President, Electronic Systems Research,
Microelectronics and Computer Technology Corp.
Our MEMS Project is a multi-company consortial R&D effort whose goal
is to identify and remove select technology and infrastructure issues
which impede the transition of MEMS (Micro-Electro-Mechanical Systems)
devices and systems from the laboratory to the market place. Current
project sponsors include 3M, Eastman Kodak, Harris Corp., Nortel Networks,
and Raytheon. The Project conducts both internal research as well as
assessments of externally sourced technology. Examples of the former
include metal MEMS switch technology and MEMS packaging processes; examples
of the latter include MEMS CAD tools and merchant foundries. We will
describe in this presentation some of our preliminary research findings,
making clear the distinction between the type of R&D which is well suited
for an industrial consortium, and that which is best performed in individual
companies or other organizations.
4:45 EXPERT PANEL DISCUSSION
Leading industry experts will participate in a wrap-up interactive strategy
session to discuss the fundamental obstacles, challenges and solutions
to achieving success in developing COTS MEMS devices.
5:15 Chairperson’s Remarks
and Close of Conference
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